Factors affecting the mechanical strength of reflowed solder joints for SMT products
27 September 2024
By By John E. O’Brien, global technologist – electrical, PennEngineering
Ref: FFT250924
At present, PennEngineering’s largest Surface Mount Technology (SMT) product line is used for providing mechanical fastening to PCBs. There is also a growing trend to use the SMTSO and SMTSOB standoffs to conduct electrical current to the board. However, this is a secondary use. With the advent of lower reflow temperatures and the use of lead-free solders, the mechanical strength of the fastener to the board joint is reduced. This paper explores those factors which influence joint strength.
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