Factors affecting the mechanical strength of reflowed solder joints for SMT products

27 September 2024

By By John E. O’Brien, global technologist – electrical, PennEngineering

Ref: FFT250924

At present, PennEngineering’s largest Surface Mount Technology (SMT) product line is used for providing mechanical fastening to PCBs. There is also a growing trend to use the SMTSO and SMTSOB standoffs to conduct electrical current to the board. However, this is a secondary use. With the advent of lower reflow temperatures and the use of lead-free solders, the mechanical strength of the fastener to the board joint is reduced. This paper explores those factors which influence joint strength.