Master Bond EP29LPSPND-3 is a two component, non-drip epoxy compound with a paste consistency that can be used for bonding and sealing applications.
The system is electrically non-conductive and thermally insulative, with a thermal conductivity of approximately 0.2 W/(m•K) at room temperature. It withstands cryogenic temperatures and is serviceable in the range up to 250°F (121.1°C).
EP29LPSPND-3 features a coefficient of thermal expansion of 45 – 50 x 10-6 in/in/°C, a tensile strength of 6,000 psi – 8,000 psi, as well as a Shore D hardness of 70 – 80. This system has a volume resistivity exceeding 1015 ohm-cm at 75°F (23.8°C) and a dielectric constant of 4.2 at 60 Hz. A key performance attribute is its ability to withstand temperature cycling even at cryogenic levels.
EP29LPSPND-3 has a mix ratio of 100:65 by weight with a long working life after mixing; a 100 gram batch will yield an open time of greater than 5 hours at 75°F and it cures clear when applied in thin sections despite being a paste, with a refractive index of 1.56 at 589Nm. Master Bond recommends a cure schedule of either 12 – 18 hours at 130°F – 150°F (54.4°C – 65.5°C) or a faster 5-10 hours at 150-165°F (65.5°C – 73.8°C). EP29LPSPND-3 is available in ounce jar kits, half pint kits, pint kits, quart kits and gallon kits.
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