Structalit® 5610 fast curing SMD adhesive 06 February 2018

Techsil has launched a new fast curing epoxy adhesive, Structalit® 5610, from manufacturers Panacol – specifically designed for bonding Surface Mounted Devices (SMDs) on to circuit boards. Due to its high viscosity the adhesive is well suited for screen printing.

Structalit® 5610 is a red coloured epoxy adhesive which makes a perfect contrast to green circuit boards. The one component adhesive is easily applied via dispenser, screen printing or needle transfer.

The SMD adhesive cures thermally within minutes, even at low temperatures. At the same time it is highly temperature-resistant: Temporarily it can be exposed to temperatures up to 280°C, making it the perfect adhesive for reflow soldering.

Once cured, Structalit 5610 is extremely shock resistant and features very high adhesion to FR4 circuit boards, to metals and to epoxy-based mould materials.

www.techsil.co.uk

Claire Aldridge Deputy Editor t: +44 (0) 1727 814 450

Having joined the magazine in 2012, Claire developed her knowledge of the industry through the numerous company visits, exhibitions and conferences she attended both in the UK and abroad.

Responsible for social media and the online platforms, Claire prides herself on keeping readers well informed and up to date with the latest industry news.