At this year’s BondExpo Panacol will present Vitralit® UC 1535, a new transparent adhesive specifically designed for use in electronics. It hardens with UV light within a few seconds and can be used for semiconductor production due to its low ion content.
The Vitralit® UC 1535 is an epoxy-based UV-curing adhesive that hardens very fast. It is easy to dispense and non shear-thinning. In just a few seconds, the adhesive can be cured with radiation in the UVA range from 320Nm to 390Nm. For a fast and efficient curing, the broad spectrum and UV/LED systems from Dr. Hoenle AG are highly recommended.
The adhesive was especially designed for the assembly and production of electronic and optomechanical components. For example, the new Vitralit® UC 1535 is being used to bond glass lenses in optical systems. Once cured the adhesive features a transparent, optically clear and brilliant surface, which is very hard and scratch resistant. Vitralit® UC 1535 is non-yellowing and remains optically clear even when exposed to high temperatures. Because of its low ion content the adhesive can be used for semiconductor applications.
BondExpo will be held in Stuttgart, Germany from the 7th - 10th October 2019.
Having joined the magazine in 2012, Claire developed her knowledge of the industry through the numerous company visits, exhibitions and conferences she attended both in the UK and abroad.
Claire prides herself on keeping readers well informed and up to date with the latest industry news.