Master Bond has recently added a new epoxy to its portfolio. Supreme 3DM-85 is a no mix, non-solvent based, one component epoxy. This thixotropic paste material was formulated to serve as the damming compound in dam-and-fill encapsulation applications – but it can also be utilised for bonding and sealing, especially where no flow is needed since the material cures in place and will not run or slump.
“Supreme 3DM-85 is designed for heat sensitive components that cannot withstand high temperatures for curing. The fact that it is not premixed and frozen gives it an advantage in production situations where freezer storage may not be practical. Also, there are no special shipping requirements,” says Rohit Ramnath, senior product engineer at Master Bond.
As a toughened system, Supreme 3DM-85 resists rigorous thermal cycling. The company states the compound requires a relatively low heat cure of 85°C for 2 – 3 hours, is thermally conductive and electrically non-conductive, making the epoxy a reliable electrical insulator. These features make Supreme 3DM-85 an ideal choice for facilitating effective heat dissipation and preventing overheating, especially in densely packed electronic assemblies. The epoxy maintains a Shore D hardness of 75 – 85, offers good damp heat resistance and has a good physical strength profile.
Supreme 3DM-85 forms strong bonds with an extensive range of substrates commonly found in electronics and semiconductors. These substrates include metals, composites, ceramics, silicon, and a wide array of plastics. As a single part system, it is easy to handle and Master Bond states the epoxy offers unlimited working life at room temperature. The epoxy, which can be applied manually or automatically, is serviceable from 100°F to +350°F (-73°C to +177°C) and is available for us in syringes and jars.
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