DELO has developed a new adhesive that can be used to create ultra-fine structures, such as those found in optical packaging applications, within seconds. DELO DUALBOND EG4797 is the latest solution in the ongoing trend towards miniaturisation.
The halogen and solvent-free acrylate allows for extremely fine microstructure designs (micro dam) in semiconductor packaging and on printed circuit boards. With it, bondlines with widths of less than 100 µm in an aspect ratio of five or more can be dispensed. This new micro dam solution was developed in close partnership with NSW Automation, a systems manufacturer which produces high precision microdispensing technologies for the semiconductor industry.
A special feature of DELO DUALBOND EG4797 is its high thixotropic index of 6.6. This enables high dispensing speeds of 15mm/s or more, all while creating a stable microstructure layer by layer – on straight as well as curved surfaces. Fine bondlines are dispensed using conical needles with a diameter of 100 µm.
After dispensing, the micro dam is cured in one step. The process can be set up flexibly while remaining energy efficient. Curing can either be carried out in 10 seconds using only UV light, in five minutes using heat at 120°C, or via a dual-curing process using both UV light and heat.
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