Developed by Panacol, Structalit® 5801 is a new two component adhesive system that demonstrates chemical and moisture resistance after accelerated aging. This resistance makes the adhesive an ideal material for the structural bonding and potting of electronic components that require the highest level of environmental protection.
A two component epoxy adhesive system with a simple 2:1 mixing ratio, the Structalit® 5801 can also be cured thermally, in as little as 30 minutes at a moderate temperature of 80°C. Lower temperature curing minimises thermal stress on components, and the shorter cycle time improves productivity. Panacol says this mediumviscosity adhesive blend has excellent adhesion to metals including aluminium and stainless steel. It is well suited for the structural bonding of metal frames and housings. The product also exhibits very good adhesion to plastics, such as PA6 GF or PBT. This multi substrate adhesion allows use for many material combinations typically found in the consumer and automotive electronics industries.
This newly developed adhesive cures with low shrinkage and exhibits good vibration and shock resistance due to its high bond strength and unitising properties. During aging tests at temperatures above 130°C, the adhesive gains bond strength. During these tests, adhesive exposure to transmission oil, biodiesel, and alcohol resulted in minimal loss of bond strength. This is mainly due to the high degree of crosslinking and the low moisture absorption of this adhesive.
The product can be dispensed from a 50ml dual chamber cartridge which is ideal for manual, short run, or semi automated production. This epoxy system is also available in sedimentation stable bulk containers which can be used with metre mix equipment for high volume production.
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