New die attach adhesive for semiconductors 03 September 2020

Adhesives are used on printed circuit boards not only for fixing components, but often also for electrical insulation. They are frequently required to be temperature resistant and to offer good dispensing properties to meet the increasing miniaturisation requirements. Due to this, DELO has launched a new die attach adhesive DELO MONOPOX EG2596.

Replacing the previous DELO MONOPOX MK096, DELO says its new EG2596 features high strength even after aging and can be dispensed more precisely than its predecessor, which has been shown in tests..

The new, die attach adhesive replaces the currently offered MK096 and is suited for long-term use. Like its predecessor, it is a heat curing one component epoxy resin. The new adhesive exhibits a 150% higher strength after seven days of storage at 85% relative air humidity and a temperature of +85°C. It maintains its strong adhesion even after typical aging tests, including the MSL1 test in accordance with JEDEC standard. When using 1x1mm² silicon dies, the test revealed adhesion values of 47N on FR4 substrate, and 62N on gold.

Another advantage of EG2596 is its high thixotropy index of ~9. The higher the index value, the more flow-resistant the dispensing pattern after the dispensing process. The thixotropic properties of the adhesive ensure that it can be applied finely in a low-viscous state, due to the shear in the dispensing valve. After dispensing, viscosity increases again in fractions of a second, preventing the adhesive from flowing. This allows the die attach to be built up in individual droplets and then shaped in a controlled manner, without the adhesive spreading into areas that should remain adhesive-free. Even during heat curing, the adhesive drop remains dimensionally stable. 

The flow properties of DELO MONOPOX EG2596 are designed to allow dispensing by means of jet valves and needles. Thanks to this flexibility, the adhesive provides versatile application options. Tests conducted jointly by DELO and its technology partner ASM Assembly Systems, a global manufacturer of SMT placement machines and solutions, show the dispensing properties of the die attach adhesive using, among other dispensing systems, the ‘Glue Feeder’.

This jet valve allows the adhesive to be dispensed contactless and upside down. The adhesive is applied directly to the specific component and not to the printed circuit board, a solution that ensures fast and highly precise processes. Depending on the dispensing equipment, drop sizes down to below 250µm can be achieved. Even after several shots, the dispensing patterns remain uniform and do not show typically unwanted effects, such as satellite droplets.

Curing takes place at +130°C in 10 minutes. The fluorescent adhesive is available in 10cc cartridges. Once opened, the product can be processed in a user-friendly manner for up to seven days in a standard climate of +23°C.

Grant Rebecca Digital Content Assistant t: +44 (0) 1727 814 522

Grant joined the magazine in 2018, bringing with him extensive knowledge of online and digital platforms. He is developing his industry knowledge through exhibition visits and the production of video interviews with key industry players.

Grant manages the digital content across the FastFix network, and is also responsible for all social media channels.