Master Bond EP114 is a two component, low viscosity, NASA low outgassing rated, heat cured epoxy that can be effectively utilised for underfill, coating, impregnating and porosity sealing applications.
This optically clear compound features high dimensional stability thanks to its nano-silica filler material. Master Bond highlights it has been successfully tested for abrasion resistance per ASTM D4060-14 and readily withstands 1,000 hours at 85°C and 85% relative humidity.
EP114 has excellent electrical insulation properties with a volume resistivity greater than 1014 ohm-cm and a dielectric constant of 3.35 (60Hz) at 25°C. This system features an exceptionally low coefficient of thermal expansion of 20 – 22 x 10-6 in/in/°C along with a compressive strength of 24,000 psi – 26,000 psi, an ultra-high modulus of more than 1,000,000 psi and a hardness of 85 – 95 Shore D at 25°C. Also, the epoxy has a glass transition temperature of more than 200°C.
EP114 features good flow properties with a mixed viscosity of 500 cps – 1,500 cps. The epoxy also offers a long working life after mixing, for example a 100g batch at 25°C will yield an open time of 2 – 4 days. The system requires heat for curing and Master bond recommends a cure schedule of 2 – 3 hours at 125°C, followed by 5 – 8 hours at 150°C, with a 2 hour or longer post cure at 150°C – 200°C.
The epoxy is available in various packaging options, such as syringe kits, ½ pint kits, pint kits, and quart kits. It can also be packaged in pre-mixed and frozen syringes, which require storage at -40°C and are suitable for automated dispensing.
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