Master Bond has launched EP53TC, a two component epoxy designed for bonding, sealing, coating and small potting applications – where efficient heat dissipation is crucial.
Formulated with a speciality filler with a particle size ranging from 5 to 30 microns, with a flowable system and a mixed viscosity of 45,000 cps – 65,000 cps at room temperature, EP53TC epoxy can fill small voids, making it ideal for heat dissipation.
EP53TC also meets ASTM E595 NASA low outgassing specifications and provides reliable electrical insulation with a volume resistivity greater than 1014 ohm-cm. Mechanical properties include a tensile strength of 5,000 psi to 7,000 psi, a tensile modulus greater than 1,000,000 psi, and a Shore D hardness of 85-95. The service temperature range is from -100°F to 300°F (-73°C to 149°C).
A moderate heat cure is required to achieve optimal properties with EP53TC. The recommended cure schedule is 2 hours at 80°C followed by a post cure of 90 – 120 minutes at 125°C. This epoxy is available in various packaging options, including ounce kits, quarter pint kits, half pint kits, pint kits and quart kits.
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