DELO has developed a new, reliable sealant adhesive for CMOS image sensors, which are often used in driver monitoring systems. Using DELO DUALBOND EG6290, glass filters can be bonded directly to the semiconductor chip.
The adhesive was specially designed for the glass-on-die assembly method, where the glass filter is fixed directly onto the chip, as is typical with iBGA image sensor packaging.
Compared to DELO’s previous products, DUALBOND EG6290 has a higher Young's modulus of 2,350 MPa, as well as a higher adhesion value.
Due to a glass transition temperature (Tg) of over 130°C, the adhesive exhibits mechanically consistent behaviour – even at high application temperatures, for example, during the molding process – and can compensate for temperature-dependent pressure changes. DUALBOND EG6290 thus fulfils the requirements of the AEC-Q100 Grade 2 automotive industry standard.
The adhesive is applied via needle dispensing. Thanks to its very high thixotropy index, narrow and high bondlines can be precisely dispensed, onto which the glass filter is then joined.
Curing takes place in two successive process steps. First, the adhesive is exposed to light with a wavelength of 365Nm or 400Nm. Then, as a result, the glass filter is fixed within a few seconds. Full cure occurs in 15 at 130ºC and this rapid curing reaction allows the matrix in the adhesive builds up quickly, which ensures the image sensor package is reliably sealed.
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