Defeat the heat in LED lighting applications 15 January 2018

Effective control of heat is an increasing concern among today's electronic device manufacturers and, as products become more compact, the need to dissipate damaging heat effectively is greater than ever.

To address the thermal demands of today's electronic devices, Techsil Ltd provides a complete portfolio of high-performance, user-friendly materials to suit a variety of current and future heat control needs.

An example of these products being put to good use is when Techsil provided I-vision Lighting Solutions with two products that improved the assembly process and heat dissipation within their LED lighting units. I-vision is a UK based energy efficient lighting company with over 25 years of experience within the lighting industry. The company supplies the architectural, entertainment, industrial, office and healthcare sectors with LED lighting solutions industrial and solutions.

I-vision needed an adhesive to use in the manufacture of its LED luminaires that not only provide a good strong bond, but also help dissipate heat away from sensitive electronics. In addition there was a requirement for a heat transfer compound to dissipate heat away from the LED boards to the heat sink.

RTV1084G was recommended, this is a ready-to-use one-part grey silicone rubber adhesive. It is fast skinning and cures to a 67 Shore A tough rubber with low linear shrinkage. It exhibits excellent primerless adhesion to many substrates.

The RTV1084G was used to attach LEDs to the board which are hand placed. The adhesive holds the LEDs securely in place which allows them to be soldered with ease. The silicon has a thermal conductivity of 2.3 W/mK so therefore also acts as a conductor between the LEDs and the circuit board. The adhesive is mainly used in the production the smaller fittings in I-vision’s Lumos range such as MR16's and Lumos 3s.

The second product selected was the G641 Heat Sink Compound from Techsil. G641 is a white, thermally conductive grease with high dielectric constant and dissipation factor. The heat sink compound is applied between the LED board and the heat sink material for the purpose of dissipating any excess heat generated by the diodes away from the LED board, towards the heat sink. This ensures that the LEDs do not overheat thus prolonging life and maintaining efficiency. At I-vision this compound is used right across its range in the manufacture of LED products, from smaller fittings such as the Lumos 3's and MR16's which contain just 3 LEDs, to larger light fittings such as the Lumos floodlight range which contain up to 48 LEDs.

Claire Aldridge Deputy Editor t: +44 (0) 1727 743 889

Having spent a decade in the fastener industry experiencing every facet – from steel mills, fastener manufacturers, wholesalers, distributors, as well as machinery builders and plating + coating companies, Claire has developed an in-depth knowledge of all things fasteners.

Alongside visiting numerous companies, exhibitions and conferences around the world, Claire has also interviewed high profile figures – focusing on key topics impacting the sector and making sure readers stay up to date with the latest developments within the industry.