Bostik further extends Born2Bond™ range for electronics 04 November 2021

Bostik, an Arkema Company, has extended its Born2BondTM engineering adhesive range designed to support the electronics manufacturing sector in the assembling, waterproofing, dustproofing and serviceability of miniaturised electronics such as wearables and handheld devices.

Born2BondTM MECA-based cyanoacrylates and innovative dual cure Light Lock adhesives are already available for electronics OEMs for high precision instant bonding, encapsulation and potting applications. Coupled with automatic dispensing solutions they provide high performing and convenient options for designers and engineers.

The new versatile and single component High Performance HMPUR (Hotmelt Polyurethane Reactive) range has been designed specifically for the manufacture of miniaturised handheld and wearable electronic devices such as mobile phones, smart watches and headphones. High Performance HMPUR products are available with a range of viscosities and open times to suit different applications and assembly processes. 

Ideal for handheld devices and wearable technology, Born2Bond High Performance HMPUR adhesives deliver excellent bonding performance (both rigid and elastic) and are capable of withstanding fluctuations in temperature and humidity, as well as being resistant to impact and chemical or organic compounds such as sweat or sebum. 

Born2Bond new UV-CIPG (UV Cure-in-place Gasket) range provides single component, precise gasketing solutions with typically 0.5mm - 2mm high gaskets for waterproofing, dustproofing and serviceability of mobile phones, tablets, smart watches, digital cameras, and automotive applications such as battery management systems (BMS), electronic control units (ECU) and advanced driver-assistance systems (ADAS).

The adhesives offer excellent adhesion to a variety of substrates including plastic, glass and metal – and provide an effective and cost-efficient solution to cut or moulded gaskets that are typically assembled by hand with significant labour costs and carry a high risk of defect. They also eliminate the need for investment in expensive and space-consuming equipment such as moulds and ovens.

The UV-CIPG range delivers an extremely flexible and robust result that does not crack even when compressed or deformed, and which can withstand exposure to temperature fluctuations and chemicals. With high thixotropic indexes, the products provide a consistent bead aspect ratio and can be rapidly and precisely dispensed using automatic dispensing equipment.

For larger applications such as smart meters and LED lights where 2mm - 5mm high gaskets are required for dust and water proofing, Bostik’s UV-FG (UV Foam Gasket) range provides a fast curing alternative to moulded gaskets that can easily be integrated into manufacturing lines. Its single component design means mixing is not required and a high foam expansion enhances resilience during the assembly process.

Claire Aldridge Deputy Editor t: +44 (0) 1727 743 889

Having joined the magazine in 2012, Claire developed her knowledge of the industry through the numerous company visits, exhibitions and conferences she attended both in the UK and abroad.

Claire prides herself on keeping readers well informed and up to date with the latest industry news.