Developments in automotive lightweight construction, the trend towards electro mobility and the need to save weight even in the case of adhesive solutions, always require new bonding solutions. The latest development from Lohmann is a family of epoxy tapes, DuploTEC® 106xx SBF, which are suitable for the structural bonding of a wide variety of materials.
Two different adhesive variants are available as tapes, one of which is available in seven different adhesive thicknesses of 35μm, 70μm, 100μm, 125μm, 200μm, 630μm, 1mm and 2mm. This allows the user to choose the appropriate tape in respect of thickness, strength of the joint and elasticity.
Whether bonding on printed circuit boards, magnetic bonding or bonding in lightweight construction, the epoxy tapes possess a strong initial tack and can therefore be pre-applied. Curing takes place at temperatures above 130 ° C, however an alternative curing method by means of induction, or in the autoclave, expands the possibilities offered in the production process. The tapes are resistant to weathering and are characterised by a very good chemical resistance - Lohmann states the tapes easily withstand chemical conditions and temperatures of a reflow process with 280 °C.
The Lohmann 'Bonding Engineers' support their customers in the design of the best adhesive solution for their application and accompany them up to the integration into their production process. At Lohmann, this is called the smart bonding approach.
Having spent a decade in the fastener industry experiencing every facet – from steel mills, fastener manufacturers, wholesalers, distributors, as well as machinery builders and plating + coating companies, Claire has developed an in-depth knowledge of all things fasteners.
Alongside visiting numerous companies, exhibitions and conferences around the world, Claire has also interviewed high profile figures – focusing on key topics impacting the sector and making sure readers stay up to date with the latest developments within the industry.
