Thermally conductive low outgassing epoxy 04 January 2022

Master Bond EP40TC is a two part epoxy system, designed for bonding, sealing and encapsulating applications where thermal conductivity and electrical insulation are required.

With a high thermal conductivity value of 8-11 BTU•in/(ft2 •hr•°F) [1.16-1.60 W/(m•K)], it is formulated with a small particle size filler making it ideal for filling small cavities and applying the product in thin sections. Its volume resistivity is greater than 1015 ohm-cm.

“EP40TC’s key distinguishing factor is that there is no compromise on the bond strength while providing excellent elongation and toughness. It has a high strength profile with a tensile lap shear strength of 2,300-2,500 psi, an elongation of 60-70%, and a tensile modulus of 5,000-15,000 psi,” says Rohit Ramnath, senior product engineer. “Also, it meets NASA low outgassing specifications which is a prerequisite for many aerospace, electronic and optical applications.”

Serviceable from -100°F to +300°F, this toughened system resists thermal cycling, vibration and shock. EP40TC exhibits a high peel strength of 40-60 pli and Shore D hardness of 70 - 80 at 75°F. It features a convenient 1:1 mix ratio, and cures in 2 - 3 days at room temperature or faster with the addition of heat. This compound adheres well to a variety of substrates such as metals, composites, glass, and many plastics. EP40TC is available in standard packaging, as well as premixed and frozen syringes.

Claire Aldridge Deputy Editor t: +44 (0) 1727 743 889

Having joined the magazine in 2012, Claire developed her knowledge of the industry through the numerous company visits, exhibitions and conferences she attended both in the UK and abroad.

Claire prides herself on keeping readers well informed and up to date with the latest industry news.