Supreme 11AOHTLP is Master Bond’s latest epoxy which meets NASA low outgassing specifications. The two component epoxy, featuring thermal conductivity and electrical insulation, is specifically designed for bonding larger parts since it has a relatively long working life of 60 – 90 minutes. This makes it uniquely suited for demanding situations where more time for fixturing is needed.
Supreme 11AOHTLP has reliable electrical insulation properties with a volume resistivity exceeding 1014 ohm-cm at 75°F (23.8°C). The product also exhibits thermal conductivity of 3-5 BTU·in (0.5-0.7 W/m/K). 11AOHTLP provides high bond strength properties with a lap shear strength of 3,200 psi – 3,400 psi, a tensile strength of 7,000 psi – 8,000 psi, a compressive strength of 20,000 psi – 22,000 psi and a T-peel strength of 15-20 pli. Additionally, this toughened formulation is designed to withstand thermal cycling and offers a wide service temperature range from -112°F to +400°F (-80°C to 204°C).
Supreme 11AOHTLP cures at room temperature in 2 – 3 days, and faster with heat in 2 – 3 hours at 200°F (93.3°C). To optimise properties, Master Bond recommends an overnight cure schedule at room temperature, followed by a post cure at 120°F – 150°F (48.8°C – 65.5°C) for 3 – 4 hours.
The new epoxy bonds well to a wide variety of substrates including metals, ceramics, glass, rubbers, and many plastics. This system also offers a convenient 1:1 mix ratio by weight, with the mixed material being a thixotropic paste. To eliminate the need for manual measuring and mixing, it can be packaged in double barrel cartridges for gun kits. It is also available in standard jars and cans, ranging in size from ½ pint to gallon containers.
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