Silver filled silicone adhesive for bonding applications 15 July 2024

Master Bond MasterSil 323S-LO is an addition cured silicone that is not only electrically conductive, but also thermally conductive. This ASTM E-595 low outgassing rated product is designed for bonding applications where low stress is critical and is appropriate for use in vacuum environments.

Suitable for use in the aerospace, electronic opto-electronic, and specialty OEM industries, MasterSil 323S-LO offers flexibility and toughness; with a Shore A hardness of 35 to 55; a low tensile modulus of less than 800 psi; and an elongation of 50% – 100%, measured at 75°F (23.8ºC). This enables it to withstand aggressive thermal cycling and mechanical shock, while offering a wide service temperature range from -80°F to +400°F (-62°C to 204°C).

MasterSil 323S-LO is a silver filled compound that has a volume resistivity of less than 0.003 ohm-cm and a thermal conductivity of 1.30 W/m•Kat – 1.59 W/m•Kat room temperature. It bonds well to a wide variety of substrates, including metals, composites, glass, ceramics, rubbers as well as many types of plastics. 

MasterSil 323S-LO has an easy to use 1:1 mix ratio by weight. The system features a paste consistency with minimal flow and does not rely on humidity access for curing, thus the formulation offers a variety of cure schedules at elevated temperatures. MasterSil 323S-LO is available for purchase in jars ranging from 20 gram kits to one pound kits.

Becca England Assistant Editor t: +44 (0) 1727 615 413

Becca is the latest member to join our team and is eager to get stuck into the world of fasteners. She brings an enthusiastic and fresh outlook on what we do editorially and will be leading our social media activity – including sourcing material, editing articles and posting online.