Toyo-Morton has developed the new ECOAD™ series of polyurethane solvent-free laminating adhesive systems for the food packaging and industrial markets, primarily in Asia, where solvent-based systems are dominant.
The ECOAD adhesive system created by the adhesives manufacturer are compatible with continuous lamination of metalised packaging structures with two or three layers, while exhibiting a smooth appearance with no degradation to metalised films. In addition, these solvent-free adhesives contain no VOCs (volatile organic compounds), offering increased sustainability to end users.
“While solvent-free adhesives are popular in Europe and the Americas, they represent only 5% – 10% of all laminating adhesives used in Japan.” explains Yusei Uchiyama, engineering team leader of Toyo-Morton. “In general, solvent-free systems are not considered suitable for the continuous processing of multilayer films, as they tend to form bubbles or warp in the laminates. Addressing the bubble problem, Toyo-Morton engineers worked to establish a new methodology for adhesive layer rheology analysis that enabled them to identify the factors that cause tunneling in metallised laminates. These findings led to the development of adhesives with enhanced physical properties, like the high heat and chemical resistance and laminate durability needed to bring about optimal adhesion without impacting the packaging material.”
Furthermore, the ECOAD solvent-free systems from the Toyo Ink Group member do not need to be diluted with an organic solvent before laminating.
“ECOAD adhesives do not include solvent, which enables savings in energy use that would normally be needed to dry the solvents. Early testing indicates that ECOAD can reduce CO2 emissions from the adhesive by up to 76% relative to conventional solvent-based products,” adds Uchiyama.
The ECOAD solvent-free series are comprised of the base adhesive EA-N6008 combined with a hardener, the EA-N5618 or EA-N5633. This solution offers improved heat resistance and durability for zipper bags and enhanced performance in continuous lamination exhibits. The solution imparts a smooth appearance in aluminium vapour deposited laminates, making it suitable for use in shampoo refill pouches and packaging for dried and boiled foods. The solution also demonstrates resistance to high acidic content and is specially designed for aluminium packaging structures such as single serve sachets for ketchup and chili sauces.
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