Specialist adhesive for applications with heat sensitive components 11 January 2018

Master Bond UV22DC80-10F is a single component, nanosilica filled compound featuring a UV and heat curing mechanism, that can be used for bonding, sealing, coating and glob-top type applications.

This thixotropic, moderately low viscosity compound has a viscosity of 8,000-12,000 cps at 75°F (~23°C). It provides outstanding dimensional stability and superior physical strength properties. Additionally, UV22DC80-10F is optically clear and offers the ability to be cured in shadowed out areas.

“It is designed to cure in 10 - 30 seconds at 365Nm with 10-40 mW/cm2 of UV output, followed by a post cure at 180°F (~80°C) for 30 - 60 minutes. This system has been specially designed for applications involving heat sensitive components. The product is serviceable from -60°F to 350°F (-51°C to 177°C) and it offers a lower coefficient of thermal expansion 30-35 x 10-6 inch/inch/°C compared to other UV curing systems,” says Rohit Ramnath, senior product engineer at Master Bond.

Master Bond UV22DC80-10F is 100% solids and is not oxygen inhibited. It is capable of curing up to thicknesses of around 0.050 inches. It has a refractive index of 1.52 at 589 nm. It is available for purchase in 10 cc and 30 cc syringes, ounce jars, ½ pint, 1 pint, and quart containers. The shelf life at 40-50°F is 6 months in the original unopened containers.

Claire Aldridge Deputy Editor t: +44 (0) 1727 814 450

Having joined the magazine in 2012, Claire developed her knowledge of the industry through the numerous company visits, exhibitions and conferences she attended both in the UK and abroad.

Responsible for social media and the online platforms, Claire prides herself on keeping readers well informed and up to date with the latest industry news.