Panacol has developed a new potting compound with medium viscosity and small filler particle size, Structalit® 5894-1, making it the perfect choice for large volume potting or glob top sealing of power electronics.
Structalit® 5894-1 is a one-component, black epoxy resin. During application it features optimum flow properties, due to its combination of optimized viscosity and small particle size of fillers. As an additional benefit, the low filler weight makes Structalit® 5894-1 less abrasive during application.
Structalit® 5894-1 cures rapidly when exposed to heat, which allows faster processing of large-volume electronic component potting and sealing. Once cured, the compound provides a smooth and level surface which is at the same time shock- and scratch-resistant.
Having joined the magazine in 2012, Claire developed her knowledge of the industry through the numerous company visits, exhibitions and conferences she attended both in the UK and abroad.
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