Master Bond thermally conductive adhesives 21 June 2019

Master Bond EP30NG is a two part epoxy adhesive system developed for applications that require high thermal conductivity. It contains a speciality graphene filler that contributes not only to its high compressive strength, but also to its enhanced dimensional stability.

EP30NG achieves an extraordinary thermal conductivity of 38.15 BTU•in/(ft2•hr•°F) [5.5 W/(m•K)] at room temperature while its compressive strength measures 22,000 psi – 24,000 psi upon cure. It has a low coefficient of thermal expansion of 24-26 x 10-6 in/in/°C and exhibits a Shore D hardness of 85-95.

“EP30NG is ideal for bonding applications where some contact pressure can be applied. The minimum bond line thickness is 0.18mm, since graphene nanoparticles tend to agglomerate to form larger particles,” comments Rohit Ramnath, senior product engineer at Master Bond. This epoxy system is formulated to cure at room temperature or more rapidly at elevated temperatures. Part A has a thick paste consistency and Part B is a low viscosity liquid.

EP30NG bonds well to a variety of substrates including metals, composites, ceramics, glass and many plastics. The service temperature range is -60°F to +300°F. The product is available in 30 cc jar kits, ½ pint kits, and pint kits.

Claire Aldridge Deputy Editor t: +44 (0) 1727 814 450

Having joined the magazine in 2012, Claire developed her knowledge of the industry through the numerous company visits, exhibitions and conferences she attended both in the UK and abroad.

Claire prides herself on keeping readers well informed and up to date with the latest industry news.