Master Bond’s new epoxy, EP5LTE-100, is a one part, non-premixed and frozen epoxy with a very low coefficient of thermal expansion, high glass transition temperature, and high modulus. These properties make the new adhesive especially useful for applications requiring good heat resistance, such as opto-electronics.
EP5LTE-100, like others in Master Bond’s portfolio, passes NASA low outgassing specifications. With a thixotropic paste consistency that makes it ideal for bonding, sealing and gap filling applications, the adhesive also provides a tensile modulus that exceeds 1,000,000 psi at room temperature. Minimal shrinkage upon curing enables precise alignment for bonding dissimilar substrates with low coefficients of thermal expansion.
EP5LTE-100 also demonstrates high glass transition between 120°C – 125°C and has a service temperature range from -60°C to +175°C, meaning the epoxy is effective in high temperature environments. Master Bond states the epoxy is also a reliable electrical insulator featuring a volume resistivity of more than 1014 ohm-cm.
The adhesive bonds well to a wide variety of substrates including metals, glass, composites, ceramics and many plastics. It has good resistance to water and damp heat. According to the company, the compound has an unlimited working life at room temperature and requires a heat cure at 100°C for 90 – 120 minutes, with optimum properties being obtained by a post curing of 2 – 3 hours at 100°C – 125°C. The new epoxy is available in syringes, jars, and cans.
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